High-Density 6-Layer RO4350B RF PCB with Blind Vias for Automotive Radar Applications
1.Premium RF Solution with Advanced Via Technology
This cutting-edge 6-layer PCB combines Rogers RO4350B high-frequency laminates with RO4450F bondply to deliver exceptional signal integrity in a compact 1.8mm package. Featuring sophisticated blind via technology (L1-L2, L3-L6, L5-L6) and ENIG surface finish, this solution is engineered for demanding 5G infrastructure, automotive radar systems, and satellite communications where precision RF performance is critical.
2.Key Material Properties
RO4350B Core
Dielectric Constant: 3.48±0.05 @10GHz
Ultra-Low Loss: 0.0037 dissipation factor @10GHz
Thermal Conductivity: 0.69 W/mK
CTE Matched to Copper: 10/12/32 ppm/°C
High Tg: >280°C
Moisture Resistance: 0.06% absorption
RO4450F Bondply
Dielectric Constant: 3.52±0.05 @10GHz
Dissipation Factor: 0.004 @10GHz
Multi-Lamination Capable: High postcure Tg
FR-4 Process Compatible: Enables hybrid constructions
3.PCB Construction Specifications
| Parameter | Specification |
|---|---|
| Base Material | RO4350B |
| Layer Count | 6-Layer |
| Board Dimensions | 98.5mm × 68mm (±0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Via Technology | Blind Vias (L1-L2, L3-L6, L5-L6) + Through-Hole |
| Finished Thickness | 1.8mm |
| Copper Weight | 1oz (35μm) all layers |
| Via Plating Thickness | 20μm |
| Surface Finish | ENIG (Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Electrical Testing | 100% tested prior to shipment |
4.PCB Stackup:
Copper layer 1 - 35 μm
Rogers RO4350B Core - 0.254 mm (10mil)
Copper layer 2 - 35 μm
-----------2x 4mil RO4450F Bondply -------------
Copper layer 1 - 35 μm
Rogers RO4350B Core - 0.254 mm (10mil)
Copper layer 2 - 35 μm
-----------1x 4mil RO4450F Bondply -------------
Copper layer 1 - 35 μm
Rogers RO4350B Core - 0.762 mm (30mil)
Copper layer 2 - 35 μm
5.Board Statistics
Components: 38
Total Pads: 92
Thru Hole Pads: 58
Top SMT Pads: 25
Bottom SMT Pads: 9
Vias: 105
Nets: 4
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Blind Via Integration: Optimizes layer transitions for RF signals
Material Synergy: RO4450F enables reliable multilayer bonding
Process Efficiency: Compatible with standard FR-4 fabrication
Thermal Reliability: Withstands multiple lamination cycles
Cost Performance: PTFE-grade RF performance at epoxy/glass cost
8.Target Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites